Advanced Packaging Limits Come into Focus

I had to read this for quite a while to be sure they weren’t actually talking about boxes

I'm really glad that last slide is in the article because I've been wondering this about Intel's push to become the king of thru-silicon vias, but didn't want to be the one sounding ignorant. When you etch holes in glass, fill the holes with metal, then solder it to something else, how does it not just shatter? The article just acknowledges the issues without suggesting where the solutions might come from.